Filed under advanced-packaging.

The Interconnect Decision That Moved Upstream

CoWoS packaging capacity — not wafer fabrication — has become the binding constraint on AI hardware, and the shortfall has reorganised how clusters are designed. Network architects who once specified fabrics after compute teams locked the BOM now sit in allocation meetings, because the interconnect bandwidth budget and the packaging timeline are the same constraint. Memory, topology, and fabric, previously sequential decisions, now collapse into one.